Shanghai-based Biren Technology, unveiled new supernode systems at the 2026 World Artificial Intelligence Conference, saying near-packaged optics could connect up to 1,024 AI processor cards in a cluster and help overcome the interconnect limitations of copper-based designs.

Founded in 2019, Biren develops AI and high-performance computing chips, including its BR100 and BR104 graphics processing units (GPUs).

The launch reflects a wider shift toward optical AI networking. Nvidia has said copper becomes impractical for many 800 Gb/s server-to-switch and switch-to-switch links in next-generation rack-scale systems.

In China, Huawei’s CloudMatrix 384 already links 384 neural processing units in an all-to-all supernode using 100% optics, underscoring the push for larger, tightly connected clusters.

Biren’s commercial path remains constrained. TSMC reportedly halted production after 2022 US export controls, and multiple Biren entities were added to the US Entity List in October 2023.

🔗 Source: South China Morning Post