TCL Zhonghuan, a Chinese maker of photovoltaic and semiconductor silicon materials, said on July 17 it plans to invest 12 billion yuan (US$1.7 billion) in a Shenzhen project through its subsidiary Shenzhen Zhonghuan Advanced Semiconductor Materials Co Ltd.

The project will produce large semiconductor silicon wafers for integrated circuits and expand its semiconductor materials business.

The facility will focus on 12-inch silicon wafers that are in short supply, including polished, epitaxial, and test wafers. It is designed to reach a monthly production capacity of 700,000 wafers.

TCL Zhonghuan said the project will take 60 months to complete, including an 18-month core construction phase.

The company said it will fund the investment with a mix of internal funds and external financing, with internal funds accounting for no more than 40% of the total.

🔗 Source: Security Times