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China, US strike trade deal to ease chip export ban
China will ease its export ban on automotive computer chips as part of a new trade deal with the US, according to the White House.
The agreement followed a meeting between US President Donald Trump and Chinese President Xi Jinping in South Korea.
China will allow trade to resume from Nexperia’s Chinese facilities, enabling the flow of critical legacy chips to global markets.
The deal also includes a one-year pause on China’s export controls of rare earth minerals used in cars, planes, and weapons.
As part of the deal, China has agreed to purchase 12 million tonnes of US soybeans in the last two months of 2025 and 25 million tonnes annually for the next three years.
China will also take significant measures to address fentanyl production, while the US will lower tariffs on imports related to the drug.
These moves aim to reduce trade tensions between the two countries.
🔗 Source: BBC
🧠 Food for thought
Implications, context, and why it matters.
China’s chip “easement” leaves supply questions unanswered
- A White House fact sheet says China will take steps to restart trade from Nexperia’s China sites. It gives no products, volumes, or dates 1.
- Nexperia holds about 5% of the global automotive silicon‑discrete market, power and signal parts like diodes and transistors with hundreds used per car 2.
- About 70% of Nexperia’s European-made chips go to China for final assembly and test, then ship back out, building a supply chain dependency 1.
- Automakers such as Volvo, Volkswagen and Jaguar Land Rover still face supply risk 1. Beijing has not issued notices, and Nexperia has not given scope, timing, or conditions 1.
Legacy chip diversification accelerates for auto OEMs and suppliers
- Temporary easing plus a one-year rare earth pause will push automotive Original Equipment Manufacturers (OEMs) to lock in non‑China 200mm capacity for analog and discrete chips 1. Rare earths support high-strength magnets in electric motors, aircraft systems, and defense. Tier-one suppliers, direct module suppliers to automakers, will do the same.
- Global 200mm wafer capacity on older-generation fabrication lines is set to grow 20% by 2025 while automotive and power semiconductor fab capacity expands 58% from 2021 to 2025 3.
- Southeast Asia is ramping 200mm capacity by 35%. Europe is adding silicon carbide (SiC) plus gallium nitride (GaN)-on-silicon lines through Infineon and STMicroelectronics, both major European chipmakers 3.
- Procurement and supply-chain leads in automotive should map outside‑China fab projects to win allocations or build inventory buffers, then invest in regional supply deals before demand shifts hit.
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