Broadcom, a US-based chip and infrastructure software supplier, is in talks to raise more than US$70 billion to US$80 billion in debt for a chip financing deal to support AI companies including Anthropic, according to reports.

The package is expected to include about US$45 billion of senior debt and about US$35 billion of junior debt, though the figures are still fluid.

Reports said the total could reach US$100 billion, with Blackstone and Apollo Global Management among the firms in talks to participate.

The discussions follow Broadcom’s June announcement of a new AI platform to enable 20 gigawatts of compute for Anthropic and OpenAI.

Blackstone and Apollo led the initial US$35 billion financing.

Broadcom also markets AI infrastructure and has announced a collaboration with OpenAI.

🔗 Source: CNBC

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