ASML, a Dutch supplier of chipmaking equipment, said Samsung plans to use its High NA extreme ultraviolet lithography machines for high-volume memory production by 2028.

TSMC plans to adopt the tools for high-volume manufacturing from 2030.

ASML also said Samsung, TSMC, and Intel have agreed to pursue larger photomasks, a component in chip production.

The group aims to move from the current 6-inch standard to 12-inch masks as AI-driven demand for advanced chips rises.

Intel has already received High NA EUV systems, which cost about US$400 million each.

ASML and TSMC plan to build a test line for 12-inch masks by 2031, then target production use with High NA tools by 2033.

SK Hynix, a South Korean memory chipmaker, is considering joining the effort.

TSMC contributes about 16% of ASML’s revenue.

🔗 Source: Bloomberg

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