Silicon Box, a Singapore-based semiconductor packaging company, said on June 8 that it secured S$100 million (US$77.53 million) in debt financing from funds managed by Ares Management Corporation, InnoVen Capital, January Capital Growth Credit, and Abound Capital.

The company said the proceeds will fund capacity expansion after its recently completed US$150 million series B2 equity round.

CEO Dr. BJ Han said the debt financing would help Silicon Box meet growing demand while limiting shareholder dilution.

Silicon Box specializes in advanced panel-level semiconductor packaging and chiplet integration for applications including AI and high-performance computing.

The company said that, as of the first quarter of 2026, it had shipped more than 250 million units at near-perfect yield from its main manufacturing facility in Singapore.

The financing comes as advanced packaging capacity for AI chips still remains constrained, although some analyses suggest front-end wafer supply has become the larger bottleneck.

🔗 Source: Silicon Box