ASE (Advanced Semiconductor Engineering) Technology Holding Co, the largest chip assembly and testing provider globally, forecasts that its revenue from advanced packaging and testing services will reach US$1.6 billion this year.

This projection represents a significant increase from US$600 million in 2024 and US$250 million in 2023, according to the company’s presentation at an investors’ conference on Feb.14.

The anticipated growth is driven by the increasing adoption of AI technology and its application in edge devices.

ASE noted that advanced packaging technology, such as chip-on-wafer-on-substrate (CoWoS), used for packaging Nvidia’s AI chips made by TSMC.