Taiwan Semiconductor Manufacturing Co (TSMC) will phase out its 6-inch wafer manufacturing business over the next two years and continue consolidating its 8-inch wafer production to boost efficiency.

The company said the move followed a market review and supports its long-term strategy.

TSMC currently runs one 6-inch and four 8-inch wafer plants in Taiwan for mature-node chips, while advanced-node chips for clients like Apple and Nvidia are made in 12-inch fabs.

TSMC said it is working with customers to ensure a smooth transition, and that these changes will not affect its previously announced financial targets.

In July 2025, the company projected about 30% revenue growth in 2025.

🔗 Source: Reuters